Semiconductor device
US9275921B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 7, 2014 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Aug 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, the connector has a first portion and a second portion. The first portion is provided on the second surface of the semiconductor chip and bonded to the second electrode. The first portion has a first bonding surface bonded to the second electrode of the semiconductor chip, and a heat dissipation surface opposite the first bonding surface and exposed from the resin. The second portion protrudes from the first portion toward the second lead frame side and thinner than the first portion. The second portion has a second bonding surface bonded to the second lead frame and a level difference portion provided near the second bonding surface at the first portion side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.