Low profile high temperature double sided flip chip power packaging
US9275938B1 · kind B1 · utility
7Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2013 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Mar 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bondless, double flip chipped discrete power package including a base plate for structural support, heat spreading, and thermal connection, power substrate for electrical interconnection and isolation, lead frames for external connections, an upper substrate for topside electrical interconnection, and injection molded housing for mounting, isolation, and protection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.