Optical sensor chip device and corresponding production method
US9275974B2 · kind B2 · utility
7Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2014 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Feb 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/193
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optical sensor chip device and a corresponding production method. The optical sensor chip device includes a substrate having a front side and a rear side; at least one first optical sensor chip for acquiring a first optical spectral range, the chip being attached to the substrate; and a first sealed cavern fashioned above an upper side of the first optical sensor chip. The first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.