Infrared sensor device and method for producing an infrared sensor device
US9276146B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Apr 12, 2013 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Apr 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An infrared sensor device includes at least one sensor element formed in a semiconductor substrate, an SOI wafer that defines a gap below and around the sensor element, and a suspension device that is configured to suspend the sensor element in the SOI wafer. The sensor element is substantially arranged below the suspension device, thereby achieving a high sensitivity, low thermal capacity, low thermal coupling to the substrate and a high image refresh rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.