Optoelectronic semiconductor component and method for producing such an optoelectronic semiconductor component

US9276183B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Andreas Gruendl · Starnberg, DE
• Stefan Gruber · Bad Abbach, DE

Key dates

• Filing date: Mar 18, 2013
• Grant date: Mar 1, 2016
• Expiry date: Mar 18, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8514

Abstract

In at least one embodiment of the optoelectronic semiconductor component (1), the optoelectronic semiconductor component has a support (2). At least one optoelectronic semiconductor chip (3) with a radiation outlet face (30) is applied onto a support upper face (20). A sacrificial layer (5) is located over the radiation outlet face (30) in the direction away from the support (2). A housing body (6) which has a housing upper face (60) is molded around the semiconductor chip (3) and/or around the sacrificial layer (5) in a lateral direction parallel to the radiation outlet face (30). A sacrificial layer (5) upper face (50) which faces away from the radiation outlet face (30) is free of a housing body (6) material.