Patent · US Active

Method to fabricate a substrate including a material disposed on the edge of one or more non through hole formed in the substrate

US9277656B2 · kind B2 · utility

1Cited by

1References

12Claims

0Family size

Assignee

Comissariat a l'Energie Atomique et aux Energies Alternatives · FR

Inventors

Sophie Giroud · Grenoble, FR
Christine Ferrandon · Saint-Égrève, FR

Key dates

Filing date	Nov 24, 2014
Grant date	Mar 1, 2016
Priority date	—
Expiry date	Nov 24, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Method for producing a substrate comprising at least one getter material arranged on the walls of at least one blind hole, comprising at least the steps of:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.