Backstrike protection during machining of cooling features
US9278462B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2013 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Jun 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49995
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of machining a component including a substrate having an outer surface and an inner surface defining at least one interior space includes: disposing a distributed medium having a plurality of irregularly shaped particles in the interior space and forming at least one hole in the substrate, while the distributed medium is disposed within the interior space, such that the distributed medium provides backstrike protection for an opposing wall during the formation of the hole(s). Each hole extends through the substrate to provide fluid communication with the respective interior space; and the method further includes removing the distributed medium from the interior space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.