Method to prevent stent damage caused by laser cutting
US9278485B2 · kind B2 · utility
1Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2013 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Mar 3, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7546
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Apparatus, method and system for cutting a polymeric stent including the use of a polymeric mandrel as a laser shielding device. The polymeric mandrel is allowed to roll freely within a polymeric tube that is cut into a polymeric stent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.