Method of bonding and debonding substrate
US9278512B2 · kind B2 · utility
1Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2014 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Nov 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.