Modular printhead sub-assembly
US9278526B1 · kind B1 · utility
0Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2014 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Oct 14, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14491
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A printhead for a printer and methods for making the printhead. The printhead may include a driver module on a jetstack. The jetstack may include a plurality of holes formed therethrough. A first adhesive layer may be disposed on the jetstack. A diaphragm plate may be disposed on the first adhesive layer. A piezoelectric layer may be disposed on the diaphragm plate. A second adhesive layer may be disposed on the piezoelectric layer. A chip on flex may be disposed on the second adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.