Patent · US Active

Bumper component with embedded sensor

US9278659B2 · kind B2 · utility

1Cited by

8References

18Claims

0Family size

Assignee

Ford Global Technologies, LLC · US

Inventors

Steven Yellin Schondorf · Dearborn, US
Abraham G. Philip · Rochester Hills, US
Mahmoud Yousef Ghannam · Canton, US
Markus Hagen · Kronau, DE
Thomas Arndt · Bad König, DE

Key dates

Filing date	Apr 22, 2014
Grant date	Mar 8, 2016
Priority date	—
Expiry date	Apr 22, 2034

Classification

Technology area (CPC G)Physics
CPC primaryG01S2013/93275
WIPO fieldTransport
WIPO sectorMechanical engineering

Abstract

Exemplary methods of making a bumper component are disclosed, along with exemplary bumper assemblies and vehicles. An exemplary method may include providing a first mold portion defining at least in part a front surface, and positioning at least one sensor in the first mold portion. Exemplary methods may further include enclosing the at least one sensor within the first mold portion with a second mold portion. The second mold portion may define at least in part a rear surface. The method may further include forming a body within the first and second mold portions, thereby embedding the at least one sensor between the front and rear surfaces, the body extending between the front and rear surfaces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.