Patent · US Active

Method for producing a sensor

US9278854B2 · kind B2 · utility

2Cited by
0References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 8, 2013
Grant dateMar 8, 2016
Priority date
Expiry dateFeb 8, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/1461
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.