Semiconductor device and method of manufacturing the same
US9281289B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2014 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Jul 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To enhance the reliability of a semiconductor device. The semiconductor device includes a wiring substrate having a plurality of bonding fingers (terminal) formed on a chip-mounting surface, a semiconductor chip mounted on the wiring substrate, a plurality of wires having a ball part and a stitch part respectively. The bonding fingers have a first bonding finger to which the stitch part of the first wire is coupled respectively, and the second bonding finger to which a ball part of the second wire is coupled. In addition, in plan view, the second bonding finger is arranged at a position different from the arrangement of a plurality of first bonding fingers, and the width of the second bonding finger is larger than the width of the first bonding finger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.