High performance audio headphones and speaker devices
US9282394B1 · kind B1 · utility
3Cited by
1References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 5, 2014 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Aug 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/1008
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headphone may include a driver assembly and a headphone cup having an adjustable airflow valve assembly and/or an adjustable headphone interior cup volume adjustment assembly. Headphone cups and/or other elements may be printed with a 3D printer, and may be tailored to a particular headphone driver element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.