Adhesive composition, adhesive varnish, adhesive film and wiring film
US9282639B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2013 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Apr 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 μm or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.