Heat conducting mounting structure, method and radio base station housing arrangement for mounting electronic modules
US9282682B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2009 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | May 30, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat conducting mounting structure for mounting of electronic modules, comprising first surface area that is adapted to face a second surface area of the electronic module; cavity means embedded at a distance from the first surface area; said cavity means is adapted to receive a cooling means; attachment means at the first surface area adapted for attaching the electronic module; and wherein the attachment means is adapted for a transfer of the heat energy from the electronic module to the mounting structure. Further a method for mounting the electronic module on the heat conducting mounting comprising the step of adjoining an attachment means with a fixing means and the fixing means with the electronic module to obtain at least one immediate connection pressure area between the first surface area of a wall and the second surface area of the electronic module. Also a radio base station housing arrangement is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.