Cooling systems for electrical equipment
US9282684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2012 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | May 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20818
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.