Digital heat injection by way of surface emitting semi-conductor devices
US9282851B2 · kind B2 · utility
4Cited by
14References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2010 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Jul 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/0057
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and system are provided for digitally injecting heat into a wide range of products by way of incorporation of a special class of semi-conductor lasers, e.g. surface emitting devices. This technique relates to a more specific, economical, and advantageous way of practicing the art of directly injecting narrowband radiant energy that desirously matches the absorption specification of a particular material at a specified wavelength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.