Sacrificial layers for bio-compatible devices
US9282920B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2013 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | May 18, 2034 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/125
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method may involve: forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer; forming a conductive pattern on the first bio-compatible layer; mounting an electronic component to the conductive pattern; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern; and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.