Apparatus including electrical lapping guide and methods of using the same
US9283651B2 · kind B2 · utility
0Cited by
6References
25Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 6, 2013 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Feb 21, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.