Integrated circuit with sensor and method of manufacturing such an integrated circuit
US9284187B2 · kind B2 · utility
2Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2012 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Sep 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20); a passivation stack (24, 26, 28) covering the metallization stack; and a sensor including a sensing material (40) on the passivation stack, said sensor being coupled to the first metal portion by a via (34) extending through the passivation stack. A method of manufacturing such an IC is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.