Pressure sensitive adhesive with butene-1 copolymers
US9284475B2 · kind B2 · utility
4Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2011 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Feb 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1452
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Pressure sensitive adhesive composition and multilayer easy peel re-closable structures thereof, comprising a butene-1 (co)polymer (A) having a content of butene-1 derived units of 80 wt % or more; a flexural modulus (MEF) of 80 MPa or less; a melting temperature DSC (TmI) lower than 110° C., and optionally a tackifier (B).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.