In-situ lapping plate mapping device
US9286930B2 · kind B2 · utility
0Cited by
25References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 4, 2013 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | May 28, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device and associated method of use can have at least an object with a work surface that contacts a lapping surface of a tool. Topography of the lapping surface can be mapped in-situ by an adjacent sensor array and the topography stored in a memory. The sensor array may be configured with a plurality of sensors positioned on opposite sides of the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.