Electronic component and fabrication method thereof
US9287044B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2013 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Jan 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness t1 and t2 of the first and second internal electrodes is 0.9 μm or less, while a roughness R1 of the first internal electrode is lower than a roughness R2 of the second internal electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.