Image sensor module and method of manufacturing the same
US9287317B2 · kind B2 · utility
1Cited by
1References
4Claims
0Family size
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Key dates
| Filing date | Jan 14, 2014 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Jan 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided an image sensor module, including: an image sensor having a small thickness of 175 μm or less and having a first coefficient of thermal expansion; a substrate having the image sensor mounted thereon and having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion; and an adhesive layer disposed between the image sensor and the substrate and including an adhesive having a third coefficient of thermal expansion of 130 ppm/° C. or more at a glass transition temperature Tg or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.