Ultraviolet reflective rough adhesive contact

US9287449B2 · kind B2 · utility

Assignee

• Sensor Electronic Technology, Inc.

Inventors

• Remigijus Gaska · Columbia, US
• Maxim S. Shatalov · Columbia, US
• Alexander Lunev · Columbia, US
• Alexander Dobrinsky · Loudonville, US
• Jinwei Yang · Columbia, US
• Michael Shur · Latham, US

Key dates

• Filing date: Jan 9, 2014
• Grant date: Mar 15, 2016
• Expiry date: Jan 27, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/831
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A device including a first semiconductor layer and a contact to the first semiconductor layer is disclosed. An interface between the first semiconductor layer and the contact includes a first roughness profile having a characteristic height and a characteristic width. The characteristic height can correspond to an average vertical distance between crests and adjacent valleys in the first roughness profile. The characteristic width can correspond to an average lateral distance between the crests and adjacent valleys in the first roughness profile.