Sensor element device and method for producing a molded body of a sensor element device
US9287866B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 5, 2012 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Nov 17, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A sensor element device for a capacitive contact switch for an operator control device with an operator panel has a molded body of an electrically nonconducting material. The molded body has an upper side that lies against an underside of the control panel in the assembled state. The molded body is transparently formed in certain portions in a direction perpendicular to its upper side as an illuminated indicator and is provided on its upper side with an electrically conductive coating. The electrically conductive coating serves as a capacitive sensor element of the capacitive contact switch and has at least one recess, which has been produced by means of a laser, to form a symbol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.