Printed circuit board and method of manufacturing the same
US9288902B2 · kind B2 · utility
0Cited by
9References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2013 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Jan 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0376
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are a printed circuit board and a method of manufacturing the same.The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.