Method and composite assembly for processing or treating a plurality of printed circuit boards and use therefor
US9288911B2 · kind B2 · utility
0Cited by
13References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2011 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | May 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a method for processing a plurality of printed circuit boards, comprising the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.