System for the radiation treatment of substrates
US9289743B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2013 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Jul 26, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2035/0827
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system for the radiation treatment of substrates, which comprises, in a chamber above the substrate holders for fitting substrates to be treated, at least one radiation source, and wherein the chamber comprises means for maintaining a gas flow in the chamber with at least one gas inlet and at least one gas outlet, characterized in that the at least one gas inlet is disposed in the region of the substrate holders in such a way that gas flowing in through the at least one gas inlet first flows around the substrate holders prior to leaving the chamber again, either directly and/or after flowing around the at least one radiation source, through the gas outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.