Patent · US Active

Mould assembly for a hot isostatic pressing process

US9289827B2 · kind B2 · utility

0Cited by
2References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 5, 2011
Grant dateMar 22, 2016
Priority date
Expiry dateDec 24, 2034

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB22F2998/00
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

This invention relates to a mould assembly for a hot isostatic pressing, HIP, process for fabricating a component, comprising: a first part which includes a shaped surface for forming a first surface of the component, the shaped surface having at least one recess; a second part arranged to move relative to the first part during the HIP process so as to compress a powder in-fill held therebetween, wherein the second part includes a formation configured to focus pressure toward the recess so as to aid consolidation of the powder in-fill at a distal end thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.