Mould assembly for a hot isostatic pressing process
US9289827B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2011 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Dec 24, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention relates to a mould assembly for a hot isostatic pressing, HIP, process for fabricating a component, comprising: a first part which includes a shaped surface for forming a first surface of the component, the shaped surface having at least one recess; a second part arranged to move relative to the first part during the HIP process so as to compress a powder in-fill held therebetween, wherein the second part includes a formation configured to focus pressure toward the recess so as to aid consolidation of the powder in-fill at a distal end thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.