Metal layer-free multi-layer film with low surface weight
US9289966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2012 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | May 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal layer-free multi-layer film with a surface weight of ≦33 g/m2, shrinkage behavior of ≦10% at 90° C. as described herein and a layer structure: a layer (a) composed of at least one thermoplastic olefin homopolymer or copolymer as an outer layer, an adhesive layer (b) inseparable under a cohesion peeling effect, a layer (c) of at least one homopolyamide and/or copolyamide, at least one internal gas barrier layer (d) adjoining layer (c) and differing from layers (c) and (e) in the composition of the polymer component(s), a layer (e) adjoining the gas barrier layer (d) and composed of at least one homopolyamide and/or copolyamide, and a layer (i) of at least one homopolyamide and/or copolyamide as an outer layer. Also disclosed is a method of using such a multi-layer film for the production of a buoyancy/lift body and a buoyancy/lift body made of such a multi-layer film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.