Laser marking method and system
US9290008B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2011 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Jul 24, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser marking method and system, and laser marked object are disclosed. The method includes directing a pulsed laser beam towards an object such that an interface between an oxidized layer and non-oxidized substrate is in a mark zone of the pulsed laser beam, and scanning the pulsed laser beam across the object in a predetermined pattern to create a mark having an L value of less than 40 and a surface roughness that is substantially unchanged compared to adjacent unmarked areas. The system includes a fiber laser generating amplified pulses that are directed towards a galvo-scanner and focusing optic, while the object includes an oxidized surface layer, an underlying non-oxidized substrate, and a mark having an L value of less than 40 with substantially unchanged roughness features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.