Method for sludge control in wet acid etching
US9290410B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | May 28, 2013 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | May 28, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K13/08
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The disclosure is directed to a method for controlling the sludge that is generated during the wet acid etching of glass articles. The four Factors that need to be controlled are (i) the dissolved glass level A; (ii) the HF concentration B; (iii) the second acid concentration C, the second acid being a strong acid, and (iv) the solubility constant D of the precipitate, Ksp, which is controlled by changing temperature or ionic strength. The disclosed method utilized HF as the etchant and a strong acid selected from the group consisting of HCI, H2SO4.HNO3 and HCIO4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.