Patent · US Active

Adsorber structure and module for a heat pump

US9291374B2 · kind B2 · utility

0Cited by
8References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 21, 2014
Grant dateMar 22, 2016
Priority date
Expiry dateMay 27, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02B30/62
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

An adsorber structure for a heat pump, having at least one pipe, through which a heat-transfer fluid can flow, and an adsorption medium, wherein a working medium can be adsorbed and desorbed on the adsorption medium and the adsorption medium is in thermal connection with the pipe, wherein the adsorption medium is designed as at least one, in particular several, molded bodies, which is/are directly adjacent to a pipe wall of one of the pipes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.