Adsorber structure and module for a heat pump
US9291374B2 · kind B2 · utility
0Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2014 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | May 27, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/62
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An adsorber structure for a heat pump, having at least one pipe, through which a heat-transfer fluid can flow, and an adsorption medium, wherein a working medium can be adsorbed and desorbed on the adsorption medium and the adsorption medium is in thermal connection with the pipe, wherein the adsorption medium is designed as at least one, in particular several, molded bodies, which is/are directly adjacent to a pipe wall of one of the pipes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.