Heat sink for processor
US9292058B2 · kind B2 · utility
6Cited by
1References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 19, 2014 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Jun 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink for a processor includes: a main heat exchange zone that bears in contact with a processor; at least one peripheral heat exchange zone that bears in contact with a cooling source, and at least one heat pipe connecting the main heat exchange zone with the peripheral heat exchange zone, the heat pipe containing a cooling fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.