Thermally sensitive wear leveling for a flash memory device that includes a plurality of flash memory modules
US9292210B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2014 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Oct 4, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C16/3495
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Thermally sensitive wear leveling for a flash memory device that includes a plurality of flash memory modules, the flash memory device included in a computing system that includes a plurality of additional computing components, including: identifying a thermal sensitivity coefficient for each flash memory module in dependence upon a physical topology of the flash memory device and one or more of the additional computing components; identifying wear leveling information for each flash memory module; receiving a request to write data to the flash memory device; selecting, in dependence upon the thermal sensitivity coefficient for each flash memory module and the wear leveling information for each flash memory module, a target flash memory module for servicing the request to write data to the flash memory device; and writing the data to the target flash memory module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.