Patent · US Active

Installation card for smart overlay and installation method using the same

US9292781B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

MXTRAN INC. · TW

Inventors

Chin-Sheng Lin · New Taipei, TW
Cheng-Chia Kuo · Hsinchu, TW
Chih-Cheng Lin · Hsinchu, TW

Key dates

Filing date	Mar 26, 2014
Grant date	Mar 22, 2016
Priority date	—
Expiry date	Mar 26, 2034

Classification

Technology area (CPC G)Physics
CPC primaryG06K19/07737
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

An installation card for a smart SIM Overlay and an installation method using the same are provided. The installation card comprises a carrier plate, a first adhesive layer, a smart overlay and a second adhesive layer. The carrier plate has a notch and a surface. The first adhesive layer adheres to the surface of the carrier plate. The smart overlay is adheres to the first adhesive layer, and the smart overlay is positioned corresponding to the notch. The second adhesive layer is adhered to the smart overlay.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.