Surface planarization method of thin film and preparing method of array substrate

US9293340B2 · kind B2 · utility

Assignees

• Beijing BOE Optoelectronics Technology Co., Ltd. · CN
• BOE Technology Group Co., Ltd. · CN

Inventors

• Lei Chen · Chengdu, CN
• Ziqi Xia · Beijing, CN
• Wukun Dai · Beijing, CN
• Jiapeng Li · Beijing, CN
• Xiuhong Jin · Beijing, CN
• Fengguo Wang · Beijing, CN
• Lei Zhang · Shanghai, CN
• Miao Qiu · Beijing, CN

Key dates

• Filing date: Jun 5, 2013
• Grant date: Mar 22, 2016
• Expiry date: Jun 5, 2033

Classification

• Technology area (CPC G): Physics
• CPC primary: G02F1/136295
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A surface planarization method of thin film and a preparing method of an array substrate relate to a display field, and can solve the technical problem that the conventional dry etching severely damages the surface flatness of other film layers below the one being etched, thereby improving the display properties of the LCD. The preparing method of the array substrate comprises patterning a non-metallic layer (4) by a dry etching. And following the step of patterning a non-metallic layer (4) by the dry etching, the method further comprises performing surface planarization on a first film layer (3) to recover the first film layer (3) with a rough surface caused by the dry etching to be planar. The first film layer (3) is located below the non-metallic layer (4).