System and method for black coating of camera cubes at wafer level
US9293505B2 · kind B2 · utility
1Cited by
2References
14Claims
0Family size
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Key dates
| Filing date | May 5, 2014 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | May 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/805
Abstract
A method for black coating camera cubes at wafer level includes expanding the gap between individual diced camera cubes of the wafer by stretching tape securing the diced camera cubes. The method includes applying a black coating layer to the stretched camera cubes, laser trimming undesired portions of the black coating layer, and removing the undesired portions of the black coating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.