Methods for electroless plating of a solar cell metallization layer
US9293624B2 · kind B2 · utility
19Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2013 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Dec 4, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for forming a contact region for a solar cell is disclosed. The method includes depositing a paste composed of a first metal above a substrate of the solar cell, curing the paste to form a first metal layer, electrolessly plating a second metal layer on the first metal layer and electrolytically plating a third metal layer on the second metal layer, where the second metal layer electrically couples the first metal layer to the third metal layer. The method can further include electrolytically plating a fourth metal layer on the third metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.