Solar cell pad dressing
US9293636B2 · kind B2 · utility
1Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2013 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Nov 27, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.