Optoelectronic component and method for producing an optoelectronic component

US9293671B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Herbert Brunner · Sinzing, DE
• Hans-Christoph Gallmeier · Regensburg, DE
• Simon Jerebic · Regensburg, DE
• Stephan Preuβ · Bad Abbach, DE
• Hansjörg Schöll · Bad Abbach, DE

Key dates

• Filing date: Apr 11, 2011
• Grant date: Mar 22, 2016
• Expiry date: Apr 11, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/854

Abstract

An optoelectronic component comprising an optoelectronic semiconductor chip (104) having a contact side (106) and a radiation coupling-out side (108) situated opposite; a chip carrier (102), on which the semiconductor chip (104) is applied via its contact side (106); a radiation conversion element (110) applied on the radiation coupling-out side (108); and a reflective potting compound (112), which is applied on the chip carrier (102) and laterally encloses the semiconductor chip (104) and the radiation conversion element (110); wherein the potting compound (112) adjoins an upper edge of the radiation conversion element (110) in a substantially flush fashion, such that a top side of the radiation conversion element (110) is free of the potting compound (112).