Method for ultrasonic bonding having at least one first and second ultrasonic transducer generating harmonic oscillation components
US9296065B2 · kind B2 · utility
2Cited by
1References
11Claims
0Family size
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Key dates
| Filing date | Jul 26, 2012 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Sep 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
In a method for ultrasonic bonding, two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms. At the connection point the ultrasonic waves cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions. At least one of the ultrasonic transducers induces an ultrasonic wave with a first harmonic oscillation component and a second oscillation component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.