Method and device for the injection of CMP slurry
US9296088B2 · kind B2 · utility
5Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2010 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Nov 6, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a certain embodiment, the invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising an injector the leading edge of which possess bays, depressions or notches that capture spent slurry and hold it long enough for it to transfer heat from the polishing reaction to the pad or through the injector to the new slurry before the said spent slurry is thrown from the polishing pad. The effect is to considerably improve the removal rate, reduce slurry consumption and reduce operating time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.