Metal dewetting methods and articles produced thereby
US9296183B2 · kind B2 · utility
2Cited by
0References
10Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 28, 2012 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Jan 30, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack disposed on a surface thereof, and dewetting at least a portion of the continuous ultra-thin metal-containing film or film stack to produce a plurality of discrete metal-containing dewetted islands on the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.