Partial curing of a microactuator mounting adhesive in a disk drive suspension
US9296188B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2015 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Feb 17, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/48
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments concern a method of attaching a microactuator to a flexure, depositing a wet mass of structural adhesive on the flexure, mounting the microactuator on the wet mass of structural adhesive, partially curing the mass of structural adhesive through a first application of curing energy, and depositing a mass of conductive adhesive on the flexure. The mass of conductive adhesive is deposited in contact with the mass of structural adhesive. The state of partial curing of the structural adhesive prevents the conductive adhesive from wicking between the flexure and the underside of the microactuator and displacing the structural adhesive which may otherwise result in shorting to a stainless steel layer of the flexure. The method further comprises fully curing the mass of structural adhesive and the conductive adhesive through a second application of curing energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.