Patent · US Active

Embossing with printed relief pattern

US9296199B2 · kind B2 · utility

0Cited by

6References

16Claims

0Family size

Assignee

Hewlett-Packard Indigo B.V. · NL

Inventors

Mark Sandler · Rehovot, IL
Shai Lior · Rehovot, IL
Eyal Peleg · Yafia, IL
Nati Sinuany · Givat Shmuel, IL
Dror Kella · Rehovot, IL
Shahar Stein · Nes Ziona, IL
George Trendafilov · Ashdod, IL
Tsahi Rosenbaom · Nesher, IL

Key dates

Filing date	May 11, 2011
Grant date	Mar 29, 2016
Priority date	—
Expiry date	May 11, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG03G15/6585
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

An embossing apparatus includes an embossing die that includes a printed relief pattern made up of multiple layers of a deposited material. A resilient surface presses media against the embossing die such that embossed features corresponding to the embossing die are formed in the media. A method for embossing media includes forming an embossing die by depositing multiple layers of ink on a impression layer to form a relief pattern and pressing media against the embossing die to transfer the relief image to the media.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.