Olefin resin composition
US9296845B2 · kind B2 · utility
3Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2014 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Sep 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is an olefin resin composition, and a method of manufacturing an encapsulant for an optoelectronic device, in which the encapsulant exhibits excellent adhesive strength with a back sheet and a front substrate included in various optoelectronic devices. In addition, the encapsulant does not have a bad influence on parts such as optoelectronic units or wiring electrodes encapsulated in an optoelectronic device, and a working environment, and can excellently maintain workability and economic feasibility of device manufacturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.