Methods for increasing throughput rates of solid-state extrusion devices
US9296882B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2014 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Sep 3, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/20
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for improving the throughput of solid-state shear pulverization and solid-state melt-extrusion devices may include the addition of a heat absorbing material with a mixture of polymeric materials in an extruder. The extruder may include one or more extrusion screws. One or more portions of the one or more extrusion screws, one or more barrel sections, and/or one or more extruder work zones may be temperature controlled to maintain a temperature of the polymeric mixture in contact therewith at or below the liquefication temperature of the polymeric materials. The liquefication temperature may be a melting point of a semi-crystalline polymer or a glass transition temperature of an amorphous polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.